IC Packaging Fair

The IC Packaging Fair is a trade exhibition devoted to the packaging and testing of semiconductors. It covers integrated circuits, power devices, optoelectronic devices and sensors, and shows equipment and materials for the whole packaging and testing process.

The fair runs as a dedicated pavilion within a larger electronics manufacturing show organized by RX. Alongside the exhibition floor, the program includes an international semiconductor packaging technology forum, themed conferences on advanced packaging, power semiconductors and optoelectronic devices, and recurring business matching sessions.

A process demonstration zone presents live packaging lines, including integrated circuit and advanced packaging workshops, IGBT and SiC module packaging, and optical module packaging.

Suppliers of die bonders, wire bonders, molding machines, sintering furnaces, dispensing equipment, inspection and testing equipment, and packaging materials such as pastes, substrates, bonding wire and photoresist.

Engineering, manufacturing, research and design staff from outsourced semiconductor assembly and test companies and from integrated device manufacturers with in-house packaging lines.